Explore Leienda’s single-color, red and near-infrared, RGB and RGBW 5050 LED packages, including high-power ceramic options. For project-specific light sources, coordinate the LED package with custom PCB, FPC or PCBA integration.
“5050” identifies the nominal 5.0 × 5.0 mm package format. It does not, by itself, define the LED’s color, wavelength, power, channel count or operating voltage. Leienda’s 5050 range includes single-color and multi-channel packages, while custom board integration extends selected packages into project-specific light-source assemblies.
Choose the package by its actual optical, electrical and mechanical specification—not by footprint alone.
Explore our comprehensive range of 5050 LED packages, from single-color and multi-wavelength configurations to integrated-IC options and custom PCBA solutions engineered for specific project requirements.
Single-color 5050 packages for projects that need one defined visible color or a single specified wavelength. Compare the emitted color or wavelength, drive current, forward voltage, viewing angle and package drawing before selecting a part.
Multi-die 5050 configurations include catalog examples combining 660 nm and 850 nm emitters in one package. Select the wavelength combination, flat or domed optical structure and operating conditions for each channel against the equipment design.
Standard multi-channel 5050 packages include RGB configurations for color mixing and RGBW configurations with an additional white channel. Compare the required channel arrangement, pin configuration, white-light requirement and flat or domed optical structure before selection.
An integrated-IC RGBW configuration appears in the 5050 catalog range as a separate project-evaluation direction. Confirm the IC type, control protocol, pinout, electrical interface and current supply status for the specific application before design approval.
Ceramic 5050 RGB and RGBW packages provide a separate construction direction for higher-power designs. Compare the selected package’s operating conditions together with the driver, board material, mounting arrangement and complete thermal path.
Extend a selected 5050 LED package into a project-specific PCB, flexible FPC or PCBA light-source assembly. Coordinate the package, board format, LED layout, power input and control interface around the finished equipment requirement.
| Configuration | Main Difference | Best Starting Point | Confirm Before Selection |
|---|---|---|---|
| Single-color | Single color or wavelength | Projects requiring a specific target wavelength/color | Current, voltage and optical requirements |
| Red / NIR multi-wavelength | Red, near-infrared or combination | Identifying emission wavelength combinations | Per-channel parameters vs. equipment purpose |
| RGB | Three color channels | Designs requiring color mixing | Control method, pins and optical structure |
| RGBW | RGB plus independent white channel | Designs needing both color mixing and white light | White light specifications and channel control |
| Integrated-IC RGBW | Catalog configuration direction with integrated IC | Projects evaluating digital control | IC type, protocol, interface and supply status |
| Ceramic RGB / RGBW | Ceramic package construction | Evaluating higher-power package directions | Actual thermal design, driver and board material |
| PCB / FPC / PCBA module | Custom integration from component to assembly | Projects with specific board or assembly needs | Dimensions, layout, power and control interfaces |
| Catalog example | Listed power | Listed drive current | Listed viewing angle |
|---|---|---|---|
| Flat red / near-infrared 5050 | 0.2 W | 20 mA × 3 | 120° |
| Flat RGB 5050 | 0.2 W or 0.5 W | 20 mA × 3 or 50 mA × 3 | 120° |
| Domed RGB 5050 | 0.2 W or 0.5 W | 20 mA × 3 or 50 mA × 3 | 90° |
| Non-IC RGBW 5050 | 0.2 W or 0.5 W | 20 mA × 4 or 50 mA × 4 | 120° |
These are selected catalog references, not universal ratings for every 5050 LED. Confirm the exact part, channel data, forward-voltage conditions and drawing before design approval.
Avoid common integration issues by reviewing the mechanical and electrical reality of the LED package early in the design cycle.
Single-color, RGB and RGBW parts have different channel arrangements. Start with the actual package drawing and channel data before choosing a driver or board layout.
For red and near-infrared projects, compare the emitter combination and each channel’s operating conditions against the equipment requirement.
Higher-power and multi-channel designs need coordinated drive, layout and thermal review. Leienda’s package and PCB/FPC/PCBA scope allows these decisions to be discussed together.
Compare single-color, red / near-infrared, RGB and RGBW 5050 directions instead of treating every 5050 package as interchangeable.
Flat, domed and ceramic examples give engineering teams different optical or package-construction starting points, subject to each part’s drawing and specifications.
When the project needs more than a loose LED package, Leienda can discuss the corresponding PCB, FPC or PCBA light-source assembly.
RGB and RGBW packages for equipment or lighting designs that require controlled channel output.
Wavelength combinations selected around the optical and electrical requirements of the finished device.
Ceramic package options evaluated together with the driver, board and thermal path.
Project-specific board formats that integrate the chosen LED package into a usable light-source assembly.
Leienda develops and manufactures LED packages and custom PCB, FPC and PCBA light-source assemblies in Shenzhen. Review the relevant package images, drawings and assembly format when aligning a 5050 component with the finished light source.
Share the package type, color or wavelength, channel arrangement and intended operating conditions. If your project needs an assembled light source, include the PCB, FPC or PCBA format so the component and board requirements can be reviewed together.
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