LED Components & Light Sources
Choose from discrete emitters, ceramic and surface-mount packages, integrated COB sources, or a light board configured for your equipment. LEIENDA supports red, near-infrared, UV, white and multicolor directions, with the final choice guided by the part specification and your optical, electrical and thermal design.
Start with the way the light source must fit your equipment. Package construction, emitting area and board integration change the optical layout, drive design and thermal path.
Single- and multi-chip lumen-style emitters provide a defined light-emitting point. The documented range includes 1W and 3W options, with single-color and mixed-wavelength configurations. Compare the specified current, viewing angle and heat path before selecting a part.
3535 and 5050 ceramic packages offer a compact route when footprint and the package-to-board thermal interface matter. Red and near-infrared, white, RGB and RGBW examples are available; electrical and optical values must be checked for the selected part.
Surface-mount packages suit automated PCB assembly and distributed LED layouts. LEIENDA’s product scope includes 3030 and other higher-current SMD configurations. A package number alone does not establish its power rating; compare the actual part construction and specification.
Multiple LED dies on one substrate create a defined emitting area. Integrated COB examples include white, red and near-infrared, RGB and other color combinations. Select by emitting area, substrate, board outline, drive arrangement and heat-sink contact.
When individual components are not the final delivery format, selected LEDs can be arranged on rigid PCB or flexible FPC boards and developed into PCBA light-source assemblies. Layout, channel grouping, mounting and connections are reviewed against the equipment design.
The right starting point depends on the light-emitting geometry and the assembly you need to receive—not on wattage alone.
| Starting point | Useful when | Check first |
|---|---|---|
| Discrete emitter | One defined emitting point must work with a lens or reflector. | Viewing angle, forward current, mounting and thermal contact. |
| Ceramic package | A compact package and its thermal interface are central to the design. | Footprint, solder land, drive condition and part-specific output. |
| SMD package | LEDs will be distributed across a PCB or used in multiple channels. | Pad layout, channel wiring, assembly conditions and binning. |
| COB source | The design needs an integrated emitting area. | Light-emitting surface, substrate, board outline and heat removal. |
| Custom board or module | The delivered light source must fit a defined device shape and connection. | Mechanical clearance, LED spacing, connector, channels and system cooling. |
Ceramic LEDs can also be surface-mount devices, and a COB source can be high power. Compare the actual construction and rated operating conditions rather than treating these terms as exclusive categories.
A wattage label is only a starting point. Output, wavelength and service life depend on how the selected LED is driven and cooled in the final assembly.
Define peak wavelength in nm for single-color or infrared devices, or CCT in K for white light. Reference directions in LEIENDA’s range include 620–630nm red, 655–665nm deep red, 845–855nm near-infrared and 660nm + 850nm combinations. Confirm the exact part, measurement condition and channel arrangement before design approval.
Compare forward voltage and rated current for each channel. RGB, RGBW and mixed-wavelength devices may require separate channel control; a single total-wattage figure does not describe their wiring or driver needs.
Review package dimensions, solder or mounting interface, board material, heat-sink contact and the intended ambient condition. Obtain the selected part’s thermal and optical data before fixing the driver and enclosure.
| Optical | Electrical | Integration |
|---|---|---|
| Peak wavelength or CCT; optical output and its test current; viewing angle | Forward voltage; rated current; channel and polarity details | Package or board drawing; thermal data; mounting and assembly conditions |
A device chosen by footprint or wattage alone can force changes to the board and heat sink later. Compare emitter, ceramic, SMD and COB constructions together with the actual mounting surface and operating current.
Red and near-infrared combinations, RGB and RGBW designs need the correct chip arrangement and electrical separation. Single- and multi-chip packages offer different starting points; the channel plan should be settled with the driver and optical layout.
A packaged device still has to fit its PCB, FPC or equipment enclosure. LEIENDA can discuss the component and the corresponding light-board or PCBA format within one project, so the optical, electrical and mechanical requirements are reviewed together.
Compare wavelength, channel control, LED density and board shape for phototherapy and beauty-device designs. The finished equipment’s optical output, exposure conditions and regulatory obligations require system-level validation.
White, blue, red and deep-red directions can be evaluated against the target spectrum and fixture layout. The LED choice must be assessed together with photon distribution, driver design and cooling in the complete grow light.
Begin with the required UV wavelength and the target process. Package selection then depends on operating current, irradiation geometry, thermal design and the safety measures of the finished system.
Select infrared wavelength and emitting geometry against the detector, optics, working distance and control method. Component choice alone does not establish sensing performance.
Compare lumen-style emitters, ceramic packages, SMD devices and integrated COB sources before committing to one optical and thermal design.
The product range includes single colors, red/near-infrared combinations and RGB or RGBW examples. Channel structure can be discussed alongside wavelength and drive requirements.
Rigid PCB, flexible FPC and PCBA formats allow the chosen LEDs to be arranged around a defined mounting space, connector position and light distribution.
LEIENDA develops and produces LED lamp beads in Shenzhen. Incoming materials and finished products are inspected as part of its production process. For a selected LED or module project, align the inspection items and required optical, electrical and reliability information with the actual part and application.
No. High power describes the operating and thermal demands of a specified LED; SMD describes how a package is mounted, while COB describes an integrated die-on-board construction. A ceramic LED may be SMD, and a COB source may also be high power. Start with the part’s rated current, optical output and thermal conditions.
Use COB when the design calls for an integrated emitting area and its matching substrate and heat path. Use discrete SMD packages when LED spacing, separate channels or a distributed board layout matter more. Then compare the actual emitting geometry, optics, electrical connections and assembly process. LEIENDA offers both packaged LEDs and integrated COB sources, so the choice can be made against the finished equipment layout.
Size the thermal path from the selected LED’s electrical input, expected heat dissipation, allowable junction temperature, package-to-board resistance, board construction, heatsink performance and ambient conditions. The wattage printed in a product name is not enough to choose a heatsink. A ceramic package, COB substrate and custom LED board each place heat into the system differently; validate the assembled design at its intended drive condition.
Match a regulated driver to the specified LED current and the circuit’s forward-voltage range. In a series string, account for the combined forward voltage and driver compliance range; for parallel branches, plan current sharing. RGB, RGBW and mixed-wavelength designs may need independently controlled channels. Confirm the pinout and operating limits of the chosen part before finalizing the supply.
Begin with the target spectrum and light distribution at the crop, then review wavelength mix, channel control, mounting density, driver efficiency and thermal conditions. LEIENDA’s white, blue, red and deep-red component directions and COB or board formats provide starting points for a fixture design. Evaluate the complete grow light rather than treating an individual LED’s wattage as its growing performance.
The LED component must be evaluated inside the finished luminaire. Weather protection, sealing, corrosion exposure, optics, driver, heat removal and required fixture tests determine outdoor suitability. A bare LED or COB source should not be assigned a fixture-level IP rating without that system evidence.
Ask whether the offer is a packaged LED, an integrated COB source or an assembled PCB/FPC light board. Compare the drawing, channel wiring, wavelength and output conditions, drive limits, thermal interface and inspection requirements. LEIENDA can discuss the component and board or PCBA configuration together; approve the selected part and assembled design against the equipment requirements.
Share the intended application and the product format you are considering. A target wavelength or color, operating condition, board drawing or reference specification helps narrow the component and assembly options.
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